The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success! To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead.
Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection applications, in compact chip package DO-214AB (SMC) size format. The Transient Voltage Suppressor series offers a choice of Working Peak Reverse Voltage from 12 V up to 43 V and Breakdown Voltage up to 52.8 V.
Halogen free
Surface mount SMC package
Standoff voltage: 12 to 43 volts
PeakPulsePower: 5000 watts
| 属性 | 数值 |
|---|---|
| 方向类型 | 单向 |
| 二极管配置 | 单路 |
| 最大钳位电压 | 53.3V |
| 最小击穿电压 | 36.7V |
| 安装类型 | 表面贴装 |
| 封装类型 | DO-214AB (SMC) |
| 最大反向待机电压 | 33V |
| 引脚数目 | 2 |
| 峰值脉冲功率耗散 | 5000W |
| 最大峰值脉冲电流 | 93.9A |
| ESD保护 | 是 |
| 每片芯片元件数目 | 1 |
| 最低工作温度 | -55 °C |
| 尺寸 | 7.11 x 6.22 x 2.42mm |
| 最高工作温度 | +150 °C |